PCB Surface Cleaning Machine

STKF Series — PCB surface cleaning machine with magnetic levitation drive, dual-sided adhesive rollers, intelligent static control, and support for multi-layer copper foil board processing (4~12mil, up to multi-layer in 3 passes).

Magnetic Levitation Drive

Smooth, stable, no noise, no vibration — safe for delicate copper foil substrates.

Multi-Layer Support

Handles 4-layer, 8-layer boards: 2-layer/1 pass, 4-layer/2 passes, multi-layer/3 passes.

Quick-Change Maintenance

Quick-change window structure for adhesive roller and paper roll — fast and easy servicing.

Product Description

The PCB Surface Cleaning Machine STKF Series is developed for printed circuit board cleaning with an all-new magnetic levitation drive that delivers smooth, stable operation — no noise, no vibration. The thin cleaning layer ensures copper foil and thin film substrates are never deformed or creased during processing.

Supporting 4-layer, 8-layer copper foil board processing (4~12mil thickness) with 2-layer/1 pass, 4-layer/2 passes, and multi-layer/3 passes capability, the STKF Series handles a wide range of PCB manufacturing requirements. Intelligent static control eliminates charge-induced defects, and the quick-change window structure makes roller maintenance fast and easy.

Product Features

All-new magnetic levitation drive design — smooth, stable operation; no noise, no vibration
Thin cleaning layer — does not deform or crease copper foil and thin film substrates
Special precision adhesive cleaning rollers — high efficiency cleaning, improves yield rate
Intelligent static control system — effectively eliminates static-induced quality defects and charge buildup
Adhesive roller and paper roll with quick-change window structure — easy and fast maintenance
Supports 4-layer, 8-layer copper foil board processing (4~12mil): 2-layer/1 pass, 4-layer/2 passes, multi-layer/3 passes

Technical Advantages

Magnetic Levitation

Frictionless drive protects delicate PCB substrates while ensuring smooth production flow.

Multi-Layer Ready

Handles complex multi-layer PCB stacks with configurable pass-through processing.

Static Control

Intelligent static elimination prevents charge-related defects throughout the cleaning process.

Technical Specifications

Model	STKF Series
Application	PCB Surface Cleaning
Drive System	Magnetic Levitation
Cleaning Method	Adhesive roller (dual-sided)
Supported Thickness	4~12mil copper foil
Layer Capacity	2-layer/1 pass, 4-layer/2 passes, multi-layer/3 passes
Static Elimination	Intelligent static control
Maintenance	Quick-change window structure
Power Supply	220V / 50Hz

Industry Applications

PCB Manufacturing Electronics Assembly Multi-layer Board Processing SMT Production

Application Scenarios

PCB Surface Preparation Before Solder Mask Application

Dust and particles on the copper surface before solder mask application cause adhesion failures, pinholes, and incomplete coverage that lead to soldering defects and corrosion in the field. The STKF Series dual-sided adhesive roller cleaning removes surface contamination from both sides of the PCB simultaneously, delivering a consistent, clean surface before the solder mask or photoresist application step.

Multi-Layer PCB Handling Between Lamination Stages

In multi-layer PCB manufacturing, inner layers must be cleaned between each lamination pass to prevent inter-layer contamination voids. The STKF Series supports 2-layer boards in 1 pass, 4-layer in 2 passes, and multi-layer boards in 3 passes, accommodating the progressive cleaning requirements of complex PCB stackups without requiring multiple different machines.

Thin Copper Foil PCB Surface Cleaning

High-density interconnect (HDI) PCBs use copper foil as thin as 4 mil, where conventional cleaning methods risk foil damage or deformation. The STKF Series' 4–12 mil copper foil support range and magnetic levitation drive provide the precise, vibration-free cleaning that thin copper foil substrates require without compromising the foil integrity.

Dual-Sided Cleaning: Why It Matters for PCBs

PCBs carry copper traces on both sides, and both surfaces must be free of contamination before each processing step. Single-sided cleaning requires two passes and board flipping, introducing handling steps that risk scratching or contaminating the already-cleaned first side. The STKF Series cleans both sides simultaneously in a single inline pass, halving the cleaning time and eliminating the contamination risk from board handling between passes. For space-constrained SMT lines requiring a compact vertical footprint, consider the PCB Vertical Cleaning System.

Frequently Asked Questions

What PCB thicknesses and copper weights does the STKF Series support?

The STKF Series supports 4–12 mil copper foil thickness. It handles 2-layer boards in 1 pass, 4-layer boards in 2 passes, and multi-layer boards in 3 passes, accommodating the full range of standard PCB stackups.

How does dual-sided cleaning work?

The STKF Series uses upper and lower adhesive rollers that simultaneously clean both surfaces of the PCB in a single pass. This eliminates the need to flip the board between cleaning passes, reducing handling steps and the risk of re-contaminating the first cleaned surface.

Does the machine use water or solvents?

No. The STKF Series uses dry adhesive roller cleaning with integrated static elimination — no water, solvents, or drying step required. This simplifies line integration and eliminates the risk of substrate warping from moisture exposure.

Can the STKF Series handle flexible PCBs?

The STKF Series is designed for rigid PCBs. For flexible printed circuits (FPCs), see the dedicated FPC cleaning machines: the 4-axis STXK Series or the 8-axis STXS Series.

What is the quick-change window structure?

The quick-change window structure provides tool-free or minimal-tool access to the adhesive roller for replacement or cleaning without disassembling the machine. This reduces roller changeover time and the skill level required for routine maintenance.

How does the STKF differ from the SMT inline cleaner?

The STKF Series is configured for PCB-specific cleaning requirements including multi-layer pass support and 4–12 mil copper foil compatibility. The SMT600 inline cleaner is optimized for high-speed continuous cleaning of boards entering an SMT production line. Contact us if you are unsure which model fits your process stage.